Year: 2022

6TH MASS EXTINCTION. “How Everything Can Collapse: A Manual for our Times.” By Pablo Servigne, Raphaël Stevens https://lnkd.in/edxZPhBU View in LinkedIn

“NGC 5033. Spiral galaxy NGC 5033 is much like our own. It’s around the same size, about 100,000 light-years across, and at its core is a supermassive black hole, weighing anywhere between 10 million and a few billion solar masses.” https://lnkd.in/gu7xi9dj View in LinkedIn

DEFECT TYPES. “Appreciable imperfections in graphene vary from dopants, folding, stacking mismatch to atomic-level defects. Bulky volume defects like ad-atom clustering compromise the benefit of graphene in terms of thinness.” https://link.springer.com/article/10.1557/s43577-021-00135-y View in LinkedIn

PERFECTION IS NULL. “In short, for new materials such as graphene, it is important that researchers understand, explore, and use the accessible materials on hand rather than pursuing scalable materials with perfection.” https://link.springer.com/article/10.1557/s43577-021-00135-y View in LinkedIn

CORE OF ELECTRONICS. “From a materials perspective, the basis of electronics relies on the discovery of semiconducting materials that are insulating most of the time, and their electrical conductivity can be controlled by the supply of external excitation.” https://link.springer.com/article/10.1557/s43577-021-00135-y View in LinkedIn

START OF SEMICONDUCTORS. “The “semiconductor era” began in the second half of the twentieth century with the invention of the integrated circuit. It is termed an integrated circuit, as all electronic components and their interconnection are integrated on a silicon chip.” https://link.springer.com/article/10.1557/s43577-021-00135-y View in LinkedIn

MICROCHIPS. “Very large scale integration (VLSI), a process to fabricate an integrated circuit consisting of thousands of digital switches on a single chip, began in the 1970s when complex communication technologies were developing.” https://link.springer.com/article/10.1557/s43577-021-00135-y View in LinkedIn

“MOORE’S LAW has successfully predicted the scaling trend of silicon-based integrated circuits, where the technology node is shrinking while the power density is doubling every 10 years.” https://link.springer.com/article/10.1557/s43577-021-00135-y View in LinkedIn

3D ELECTRONICS. “It is now the “FinFET era.” FinFET is a three-dimensional (3D) structured semiconductor that wraps the fin-shaped gate with insulator (i.e., gate oxide) around the source and drain. This replaces the previous planar structure of an electronic switch (or technically known as a transistor), where the gate sits flat above the source and drain.” https://link.springer.com/article/10.1557/s43577-021-00135-y View in LinkedIn

CARBON ALLOTROPE. “Among extreme materials, graphene, a two-dimensional semimetal with a very small overlap between conductance and valence bands, has received substantial attention and been associated with two Nobel Prizes in Physics in 2010 and 2016, respectively.” https://link.springer.com/article/10.1557/s43577-021-00135-y View in LinkedIn